Semiconductor device and method of manufacturing semiconductor device

ABSTRACT

A semiconductor device includes a first chip including a first substrate, a first cell array, a first metal wire, and a first bonding structure, wherein the first bonding structure includes a first through portion that passes through the first metal wire and a first bonding portion that is formed in the first substrate, and a second chip, bonded to the first chip, including a second substrate, a second cell array, a second metal wire, and a second bonding structure, wherein the second bonding structure includes a second through portion that passes through the second metal wire and a second bonding portion that is formed in the second substrate, and bonded to the first chip. The first bonding portion of the first chip is configured to be bonded to the second through portion of the second chip.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. § 119(a) toKorean patent application number 10-2019-0140874, filed on Nov. 6, 2019,in the Korean Intellectual Property Office, the entire disclosure ofwhich is incorporated herein by reference.

BACKGROUND 1. Technical Field

The present disclosure relates to an electronic device, and moreparticularly, to a semiconductor device and a method of manufacturingthe semiconductor device.

2. Related Art

A non-volatile memory element is a memory element that retains storeddata regardless of whether power is on or off. Increasing theintegration density of two-dimensional non-volatile memory devices,forming memory cells in a single layer over a substrate, has beendifficult. Thus, three-dimensional non-volatile memory devices have beenproposed in which memory cells are stacked in a vertical direction overa substrate.

The three-dimensional non-volatile memory element includes interlayerinsulating films and gate electrodes that are stacked in an alternatingmanner. The three-dimensional non-volatile memory element also includeschannel films that pass through the interlayer insulating films and thegate electrodes and memory cells that are stacked along the channelfilms. Various structures and manufacturing methods have been developedto improve operation reliability of the non-volatile memory element thathas such a three-dimensional structure.

SUMMARY

A semiconductor device according to an embodiment of the presentdisclosure may include a first chip including a first substrate, a firstcell array, a first metal wire, and a first bonding structure, whereinthe first bonding structure includes a first through portion that passesthrough the first metal wire and a first bonding portion that is formedin the first substrate, and a second chip, bonded to the first chip,including a second substrate, a second cell array, a second metal wire,and a second bonding structure, wherein the second bonding structureincludes a second through portion that passes through the second metalwire and a second bonding portion that is formed in the secondsubstrate. The first bonding portion of the first chip is configured tobe bonded to the second through portion of the second chip.

A semiconductor device according to an embodiment of the presentdisclosure may include a first chip including a first substrate, a firstmetal wire, a first bonding structure, and a first interlayer insulatingfilm, wherein the first metal wire and the first interlayer insulatingfilm are formed on a front surface of the first substrate, and the firstbonding structure includes a first through portion that passes throughthe first metal wire and a first bonding portion that is formed in thefirst substrate and exposed to an exterior of the first chip through arear surface of the first substrate, and a second chip, bonded to thefirst chip, including a second substrate, a second metal wire, a secondbonding structure, and a second interlayer insulating film, wherein thesecond metal wire and the second interlayer insulating film are formedon a front surface of the second substrate, and the second bondingstructure includes a second through portion that passes through thesecond metal wire and a second bonding portion that is formed in thesecond substrate and exposed to an exterior of the second chip through arear surface of the second substrate. The rear surface of the firstsubstrate and the second interlayer insulating film are bonded to eachother at a bonding interface between the first chip and the second chip.The first bonding portion may be bonded to the second through portion.

A method of manufacturing a semiconductor device according to anembodiment of the present disclosure may include forming a first cellarray on a front surface of a first substrate, forming a first metalwire on the front surface of the first substrate, forming a firstinterlayer insulating film on the first metal wire, forming a firstopening that passes through the first interlayer insulating film and thefirst metal wire to expose the front surface of the first substrate,forming a second opening connected to the first opening, wherein thesecond opening is formed in the first substrate, forming a first bondingstructure including a first through portion in the first opening and afirst bonding portion in the second opening, and exposing the firstbonding structure through a rear surface of the first substrate.

A method of manufacturing a semiconductor device according to anembodiment of the present disclosure may include forming a first chipincluding a first substrate, a first cell array, a first metal wire, anda first bonding structure, wherein the first bonding structure includesa first through portion that passes through the first metal wire and afirst bonding portion that is formed in the first substrate, forming asecond chip, bonded to the first chip, including a second substrate, asecond cell array, a second metal wire, and a second bonding structure,wherein the second bonding structure includes a second through portionthat passes through the second metal wire and a second bonding portionthat is formed in the second substrate, and bonding the first chip tothe second chip to bond the first bonding portion of the first chip tothe second through portion of the second chip.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are cross-sectional views, illustrating a structure of asemiconductor device, according to an embodiment of the presentdisclosure.

FIGS. 2A to 2D are diagrams, illustrating the structure of thesemiconductor device, according to an embodiment of the presentdisclosure.

FIG. 3 is a flowchart for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure.

FIGS. 4A to 4G are diagrams for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure.

FIGS. 5A to 5C are diagrams for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure.

FIG. 6 is a block diagram, illustrating a configuration of a memorysystem, according to an embodiment of the present disclosure.

FIG. 7 is a block diagram, illustrating a configuration of a memorysystem, according to an embodiment of the present disclosure.

FIG. 8 is a block diagram illustrating a configuration of a computingsystem according to an embodiment of the present disclosure.

FIG. 9 is a block diagram, illustrating a computing system, according toan embodiment of the present disclosure.

DETAILED DESCRIPTION

Specific structural or functional descriptions of embodiments accordingto the concept which are disclosed in the present specification orapplication are illustrated only to describe the embodiments accordingto the concept of the present disclosure. The embodiments according tothe concept of the present disclosure may be carried out in variousforms and the descriptions are not limited to the embodiments describedin the present specification or application.

It will be understood that although the terms “first”, “second”, “third”etc. are used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another element. Thus, a first element in someembodiments could be termed a second element in other embodimentswithout departing from the teachings of the present disclosure.

Further, it will be understood that when an element is referred to asbeing “connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

An embodiment of the present disclosure provides a semiconductor deviceand a method of manufacturing the semiconductor device having a stablestructure and an improved characteristic.

A semiconductor device having a stable structure and improvedreliability may be provided. In addition, in manufacturing asemiconductor device, difficulty of a process may be reduced, aprocedure may be simplified, and the cost may be reduced.

FIGS. 1A to 1C are cross-sectional views, illustrating a structure of asemiconductor device, according to an embodiment of the presentdisclosure.

Referring to FIG. 1A, the semiconductor device may include a chip CHIP.The chip CHIP may include a substrate SUB, a metal wire ML, and abonding structure BS. In addition, the chip CHIP may further include atleast one of a main structure MS, an interlayer insulating film IL, andan insulating spacer SP.

The chip CHIP may include a main region MR and a bonding pad region BR.The main structure MS may be positioned in the main region MR, and thebonding structure BS may be positioned in the bonding pad region BR. Themetal wire ML and the interlayer insulating film IL may be positioned inthe main region MR and the bonding pad region BR.

The substrate SUB may be a semiconductor substrate. The substrate SUBmay include a front surface FS and a rear surface RS, the rear surfaceRS being on the opposite side of the front surface FS. The mainstructure MS and the interlayer insulating film IL may be formed on thefront surface FS of the substrate SUB. The interlayer insulating film ILmay be a single film or a multilayer film. The interlayer insulatingfilm IL may include an insulating material, such as an oxide or anitride. The main structure MS and the metal wire ML may be formed inthe interlayer insulating film IL.

The main structure MS may include a cell array, a peripheral circuit, ora combination thereof. In addition, the main structure MS may furtherinclude an interconnection structure that is electrically connected tothe cell array or the peripheral circuit. The interconnection structuremay include a contact plug, a wire, and the like.

The cell array may include memory cells that are stacked on thesubstrate SUB. For example, the cell array includes a memory string thatis connected between a bit line and a source line. The memory string mayinclude at least one drain select transistor, a plurality of memorycells, and at least one source select transistor, all connected inseries. Alternatively, the memory string may include at least one drainselect transistor, a plurality of drain side memory cells, at least onepipe transistor, a plurality of source side memory cells, and at leastone source select transistor, all connected in series. The peripheralcircuit is for driving the memory string and may include a transistor, acapacitor, a resistor, an inductor, an amplifier, a logic circuit, andthe like.

Based on the type, function, and other characteristics of the mainstructure MS that is included in the chip CHIP, the chip CHIP may be acell chip, a peripheral circuit chip, a memory chip, or the like. Whenthe main structure MS includes a cell array, the chip CHIP may be thecell chip. When the main structure MS includes a peripheral circuit, thechip CHIP may be the peripheral circuit chip. When the main structure MSincludes both cell array and peripheral circuits, the chip CHIP may bethe memory chip. In addition, a plurality of chips CHIP may be bonded toeach other.

The bonding structure BS may bond the chips CHIP and provide anelectrical connection between the chips CHIP. The bonding structure BSmay pass through the chip CHIP by passing through the interlayerinsulating film IL and the substrate SUB.

The bonding structure BS may include a through portion TP and a bondingportion BP. The through portion TP may pass through the interlayerinsulating film IL and may pass through the metal wire ML. The throughportion TP may be electrically connected to the metal wire ML. Thebonding portion BP may be formed in the substrate SUB, and may beexposed to the exterior of the chip CHIP through the rear surface RS ofthe substrate SUB.

The chip CHIP may include a first surface S1 and a second surface S2,the second surface being on the opposite side of the first surface S1.Here, the first surface S1 may be an upper surface of the chip CHIP, andthe second surface S2 may be a lower surface of the chip CHIP. However,the upper surface and the lower surface are relative terms, and thefirst surface S1 may be the lower surface and the second surface S2 maybe the upper surface based on perspective. The through portion TP may beexposed to the exterior of the chip CHIP through the first surface S1 ofthe chip CHIP, and the bonding portion BP may be exposed to the exteriorof the chip CHIP through the second surface S2 of the chip CHIP.

The bonding portion BP may have a rounded sidewall. The sidewall of thebonding portion BP may have a curvature. The bonding portion BP may havean upper surface adjacent to the front surface FS, a lower surfacecoplanar with the rear surface RS and the sidewall coupling the uppersurface and the lower surface. The bonding portion BP may have a roundedcorner where the upper surface and the sidewall converge, in thecross-sectional view. The bonding portion BP may have a rounded cornerwhere the front surface FS of the substrate SUB and the sidewall of thebonding portion BP converge. In addition, the insulating spacer SP maybe interposed between the bonding portion BP and the substrate SUB. Theinsulating spacer SP may include an insulating material such as an oxideor a nitride. The bonding portion BP and the substrate SUB may beinsulated from each other through the insulating spacer SP.

The through portion TP and the bonding portion BP may have substantiallythe same width or may have different widths. The bonding portion BP mayhave a width that is wider than a width of the through portion TP. Thethrough portion TP may have a first width W1 at the first surface S1,and the bonding portion BP may have a second width W2 at the secondsurface S2. The second width W2 may be substantially the same as thefirst width W1 or may be wider than the first width W1.

The bonding structure BS may be a single film or a multilayer film. Thethrough portion TP and the bonding portion BP may be an integrallyconnected single film. The bonding structure BS may include a conductivematerial, and may include a metal such as copper.

Referring to FIGS. 1B and 1C, the semiconductor device may include afirst chip CHIP_1 and a second chip CHIP_2. The second chip CHIP_2 maybe bonded to the first chip CHIP_1, and a bonding interface IF may existbetween the first chip CHIP_1 and the second chip CHIP_2.

The first chip CHIP_1 may include a first substrate SUB_1, a first metalwire ML1, a first bonding structure BS1, a first main structure MS1, afirst interlayer the insulating film IL1, and the first insulatingspacer SP1. The first bonding structure BS1. may include a first throughportion TP1 and a first bonding portion BP1. The first substrate SUB1may include a first front surface FS1 and a first rear surface RS1. Thefirst bonding portion BP1 may be exposed to the exterior of the firstchip CHIP_1 from the first rear surface RS1 of the first substrateSUB_1.

The second chip CHIP_2 may include a second substrate SUB_2, a secondmetal wire ML2, a second bonding structure BS2, a second main structureMS2, a second interlayer insulating film IL2, and a second insulatingspacer SP2. The second bonding structure BS2 may include a secondthrough portion TP2 and a second bonding portion BP2. The secondsubstrate SUB2 may include a second front surface FS2 and a second rearsurface RS2. The second bonding portion BP2 may be exposed to theexterior of the second chip CHIP_2 from the second rear surface RS2 ofthe second substrate SUB_2.

The first substrate SUB1 may be positioned between the first mainstructure MS1 and the second main structure MS2. The second mainstructure MS2 may be positioned between the first substrate SUB_1 andthe second substrate SUB_2. The second metal wire ML2 may be positionedbetween the first substrate SUB_1 and the second substrate SUB_2. Forreference, FIG. 1B shows a structure in which the first chip CHIP_1 ispositioned on the second chip CHIP_2. However, the second chip CHIP_2may be positioned on the first chip CHIP_1.

The first bonding portion BP1 and the second through portion TP2 may bebonded to each other at the bonding interface IF. The first bondingportion BP1 and the second through portion TP2 may directly come incontact with each other and may be electrically connected to each other.In addition, the first rear surface RS1 of the first substrate SUB1 andthe second interlayer insulating film IL2 may be bonded to each other atthe bonding interface IF. For example, the first rear surface RS1 of thefirst substrate SUB1 and the second interlayer insulating film IL2 maybe bonded to each other by the Van der Waals force.

A structure in the first chip CHIP_1 and a structure in the second chipCHIP_2 may be positioned to correspond to each other. Based on thebonding interface IF, the first main structure MS1 and the second mainstructure MS2 may be aligned with each other and may be arranged up anddown. Based on the bonding interface IF, the first bonding structure BS1and the second bonding structure BS2 may also be positioned to alignedwith each other and may be arranged up and down. Referring to FIG. 1B,the first bonding structure BS1 and the second bonding structure BS2 maybe arranged so that the centers of the first bonding structure BS1 andthe second bonding structure BS2 are aligned.

Referring to FIG. 1C, the first chip CHIP_1 and the second chip CHIP_2may be misaligned, and the first bonding structure BS1 and the secondbonding structure BS2 may be arranged so that the centers of the firstbonding structure BS1 and the second bonding structure BS2 may bemisaligned. Since the first bonding portion BP1 is wider than the secondthrough portion TP2, the first chip CHIP_1 and the second chip CHIP_2may still be electrically connected to each other even though the firstchip CHIP_1 and the second chip CHIP_2 are misaligned.

According to the structure described above, the bonding portions BP1 andBP2 are formed in the first substrate SUB1 and the second substrateSUB2, respectively. In addition, the first chip CHIP_1 and the secondchip CHIP_2 may be electrically connected to each other using the firstbonding structure BS1 and the second bonding structure BS2. Therefore,since an additional structure, such as a bump or a non-conductive film(NCF), is not interposed between the first chip CHIP_1 and the secondchip CHIP_2, the height of the package may be reduced.

Since the width of the first bonding portion BP1 is wider than the widthof the second through portion TP2 at the bonding interface IF, themargin of error for alignment may be increased. In addition, since thedisposition of the power line is free in disposing wires, the speed ofthe semiconductor device may be improved.

FIGS. 2A to 2D are diagrams, illustrating the structure of thesemiconductor device, according to an embodiment of the presentdisclosure.

Referring to FIG. 2A, a first chip CHIP_1 may include a first substrateSUB_1, a first metal wire ML1, and a first bonding structure BS1. Inaddition, the first chip CHIP_1 may further include at least one of afirst main structure MS1, a first interlayer insulating film IL1, and afirst insulating spacer SP1.

The first main structure MS1 may include a cell array CA and aperipheral circuit PR. The cell array CA may include a stack ST and achannel structure CH. The stack ST may include conductive films 21 andinsulating films 22 that are stacked in an alternating manner. Thechannel structure CH may include a channel film 24 that passes throughthe stack ST and a memory film 23 that is interposed between the channelfilm 24 and the conductive films 21. The memory film 23 may furtherinclude at least one of a charge blocking film, a data storage film, anda tunnel insulating film. The channel film 24 may have a tube-likestructure, and a gap fill insulating film (not shown) may be formedinside the channel film 24. The peripheral circuit PR may include atransistor TR, and the transistor TR may include a gate electrode 26 anda gate insulating film 25. The peripheral circuit PR may be positionedat the same level as the cell array or may be positioned at a leveldifferent from that of the cell array.

In addition, the first main structure MS1 may further include aninterconnection structure IT that is connected to the cell array CA orthe peripheral circuit PR. The interconnection structure IT may includea contact plug 27, a wire 28, and the like.

A second chip CHIP_2 may include a second substrate SUB_2, a secondmetal wire ML2, and a second bonding structure BS2. In addition, thesecond chip CHIP_2 may further include at least one of a second mainstructure MS2, a second interlayer insulating film IL2, and a secondinsulating spacer SP2.

The second main structure MS2 may include a cell array CA and aperipheral circuit PR. In addition, the second main structure MS2 mayfurther include an interconnection structure IT that is connected to thecell array CA or the peripheral circuit PR. Since a detailedconfiguration of the second main structure MS2 is similar to that of thefirst main structure MS1, repetitive description thereof will beomitted.

Referring to FIG. 2B, a first chip CHIP_1 may include a first mainstructure MS1, and the first main structure MS1 may include a cell arrayCA. In addition, the first main structure MS1 may further include aninterconnection structure that is connected to the cell array CA.

A second chip CHIP_2 may include a second main structure MS2, and thesecond main structure MS2 may include a peripheral circuit PR. Inaddition, the second main structure MS2 may further include aninterconnection structure that is connected to the peripheral circuitPR.

Referring to FIG. 2C, a first chip CHIP_1 may include a first mainstructure MS1, and the first main structure MS1 may include a cell arrayCA. In addition, the first main structure MS1 may further include aninterconnection structure that is connected to the cell array CA.

A second chip CHIP_2 may include a second main structure MS2, and thesecond main structure MS2 may include a cell array CA. In addition, thesecond main structure MS2 may further include an interconnectionstructure IT that is connected to the cell array CA. For reference,although not shown in the present figure, a third chip that includes aperipheral circuit may be further bonded to the first chip CHIP_1 or thesecond chip CHIP_2.

Referring to FIG. 2D, a first chip CHIP_1 may include a first mainstructure MS1, and the first main structure MS1 may include a cell arrayCA. In addition, the first main structure MS1 may further include aninterconnection structure that is connected to the cell array CA.

A second chip CHIP_2 may include a second main structure MS2, and thesecond main structure MS2 may include a cell array CA and a peripheralcircuit PR. In addition, the second main structure MS2 may furtherinclude an interconnection structure that is connected to the cell arrayCA or the peripheral circuit PR.

According to the structure described above, a plurality of chips may bebonded to each other. The bonded chips may have the same main structureor may have different main structures. The bonded chips may beelectrically connected to each other and may share a portion of the mainstructure. For example, some of the bonded chips may include aperipheral circuit, and in another embodiment, the chips may share aperipheral circuit.

FIG. 3 is a flowchart for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure.

First, a FAB process is performed (S310). Here, the FAB process is alsoreferred to as a wafer level process or an in-line process. The FABprocess entails the repeated formation of a pattern on a wafer to form adie that has an integrated circuit. Here, the die may be a chip or asemiconductor chip. The FAB process may include a process of forming acell array on a substrate, a process of forming a peripheral circuit ona substrate, or a process of forming a cell array and a peripheralcircuit on a substrate. In addition, the FAB process may include aprocess of forming an interconnection that is connected to the cellarray or the peripheral circuit.

The FAB process may further include a wafer test. The wafer test is fortesting an electrical characteristic of the die. The wafer test maydetermine a bad die and a normal die. In addition, the FAB process mayfurther include a process of forming a bonding structure. For example,the bonding structure may be formed after an interconnection is formed.Alternatively, the bonding structure may be formed after performing thewafer test.

Next, a package process is performed (S320). The package process entailsthe connection of an electrical wire so that a chip may receive externalpower or communicate with an external device. The package process mayalso entail the packaging of the chip to protect the chip from physicalimpact or a chemical reaction. The package process may include agrinding process, a cutting process, a bonding process, a markingprocess, a molding process, and the like. Here, the bonding process mayinclude a process of bonding a chip and a chip to each other, a processof bonding a chip and a wafer to each other, a process of bonding awafer and a wafer to each other, a wire bonding process, and the like.

According to the process described above, the bonding structure isformed before the package process. For example, the bonding structure isformed in advance in the FAB process. Therefore, a bump, anon-conductive film (NCF), or the like is not required to be formed inthe package process. In addition, the chips may be physically andelectrically connected to each other at the same time through thebonding process. Therefore, the package process may be simplified andthe cost may be reduced.

FIGS. 4A to 4G are diagrams for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure. Hereinafter, description that is repetitive will be omitted.

Referring to FIG. 4A, a main structure MS is formed on a substrate 40.The substrate 40 may be a semiconductor substrate including asemiconductor material such as silicon. The substrate 40 may be a wafer.The substrate 40 may include a main region MR and a bonding pad regionBR. The main region MR may include a cell array region CAR and aperipheral circuit region PRR. For reference, the main region MR mayinclude only the cell array region CAR or only the peripheral circuitregion PRR.

Next, a main structure MS is formed on a front surface FS of thesubstrate 40. The main structure MS may be formed in the main region MRand may include at least one of a cell array and a peripheral circuit. Acell array may be formed in the cell array region CAR, and a peripheralcircuit may be formed in the peripheral circuit region PRR.

The cell array CA may include a stack ST and a channel structure CH. Thestack ST may include conductive films 51 and insulating films 52 thatare stacked in an alternating manner. The channel structure CH mayinclude a channel film 54 that passes through the stack ST and a memoryfilm 53 that is interposed between the channel film 54 and theconductive films 51. The memory film 53 may further include at least oneof a charge blocking film, a data storage film, and a tunnel insulatingfilm. The channel film 54 may have a tube-like structure, and a gap fillinsulating film (not shown) may be formed inside the channel film 54.The peripheral circuit PR may include a transistor TR, and thetransistor TR may include a gate electrode 56 and a gate insulating film55.

In addition, the main structure MS may further include at least one ofan interconnection structure IT that is connected to the cell array CAand an interconnection structure IT that is connected to the peripheralcircuit PR. The interconnection structure IT may include a contact plug57, a wire 58, and the like.

The first interlayer insulating film 41 may be formed in the main regionMR and the bonding pad region BR. The first interlayer insulating film41 may include an insulating material, such as an oxide or nitride. Thefirst interlayer insulating film 41 may be a single film or a multilayerfilm. The main structure MS, such as the cell array, the peripheralcircuit, and the interconnection structure, may be formed in the firstinterlayer insulating film 41. The first interlayer insulating film 41may be formed before or after the forming of the cell array, theperipheral circuit, or the interconnection structure.

Next, a metal wire 42 is formed on the first interlayer insulating film41. The metal wire 42 may be formed in the main region MR and thebonding pad region BR. For example, after forming a metal film on theinterlayer insulating film 41, a mask pattern is formed on the metalfilm. Next, the metal film is etched by using the mask pattern as anetching barrier to form the metal wire 42. After the metal wire 42 isformed, the mask pattern may be removed, and a cleaning process may beperformed. The metal wire 42 may include a metal, such as aluminum.

Referring to FIG. 4B, a second interlayer insulating film 43 is formedon the metal wire 42. After an insulating material is deposited on themetal wire 42, a planarization process may be performed to form thesecond interlayer insulating film 43. The planarization process may beperformed through a method of chemical mechanical polishing (CMP). Thesecond interlayer insulating film 43 may include an insulating material,such as an oxide or a nitride. For example, the second interlayerinsulating film 43 may include an oxide film formed through a method ofhigh density plasma (HDP).

Next, a first opening OP1, passing through the second interlayerinsulating film 43, the metal wire 42, and the first interlayerinsulating film 41 and exposing the substrate 40, is formed. The firstopening OP1 may be formed by using an etching process. First, a maskpattern 44, used for forming a bonding structure, is formed on thesecond interlayer insulating film 43. The mask pattern 44 may cover thecell array region CAR and the peripheral circuit region PRR andpartially expose the bonding pad region BR. Next, the first opening OP1is formed by etching the second interlayer insulating film 43, the metalwire 42, and the first interlayer insulating film 41 by using the maskpattern 44 as an etching barrier. After forming the first opening OP1,the mask pattern 44 may be removed and a cleaning process may beperformed.

The first opening OP1 may be formed at a depth that exposes thesubstrate 40. The first opening OP1 may pass through the metal wire 42,and the metal wire 42 may be exposed through the first opening OP1.

Referring to FIG. 4C, a protective spacer 45 is formed in the firstopening OP1. The protective spacer 45 protects the first interlayerinsulating film 41, the metal wire 42, and the second interlayerinsulating film 43 in a subsequent process. The protective spacer 45 mayinclude a material that has a high etching selectivity with respect tothe substrate 40. When the substrate 40 includes silicon, the protectivespacer 45 may include nitride. In an embodiment, after forming a spacermaterial along an inner surface of the first opening OP1, an etch backprocess is performed. The spacer material, formed on a lower surface ofthe first opening OP1, may be etched through the etch back process, andthe protective spacer 45 may be formed.

Next, the substrate 40 is etched to form a second opening OP2. Thesecond opening OP2 may be connected to the first opening OP1. The secondopening OP2 may be wider than the first opening OP1. The second openingOP2 may be formed by using an isotropic etching process. For example,the second opening OP2 is formed by using a dry cleaning process, a wetetching process, or a combination thereof. The second opening OP2 mayhave corners between an upper surface and a sidewall and between a lowersurface and the sidewall, in a cross-sectional view. In addition, atleast one of the corners may have a rounded shape. For example, thesecond opening OP2 may have a bulb shape.

Referring to FIG. 4D, an insulating spacer 46 is formed in the secondopening OP2. The bonding structure and the substrate 40, formed in asubsequent process, may be insulated from each other through theinsulating spacer 46. The insulating spacer 46 may include an insulatingmaterial, such as an oxide or a nitride. The insulating spacer 46 may beformed along an inner surface of the second opening OP2. For example, asurface of the second substrate 40 that is exposed through the secondopening OP2 is oxidized to form the insulating spacer 46. Since themetal wire 42, which is exposed through the first opening OP1, isprotected by the protective spacer 45, the metal wire 42 may beprevented from being oxidized in the oxidation process.

Referring to FIG. 4E, the protective spacer 45 is removed. Next, abonding structure 47 is formed in the first opening OP1 and the secondopening OP2. The bonding structure 47 may include a through portion 47Ain the first opening OP1 and a bonding portion 47B in the second openingOP2. The through portion 47A may be in contact with the metal wire 42.The bonding portion 47B may be formed in the substrate 40 and may be incontact with the insulating spacer 46.

The bonding structure 47 may include a metal, such as copper, and may beformed through a deposition method. For example, the bonding structure47 is formed through an electroless plating (EP) deposition method.After a metal film is formed to fill the first and second openings OP1and OP2, the bonding structure 47 may be formed by planarizing the metalfilm. A planarization process may be performed based on the chemicalmechanical polishing (CMP) method.

Referring to FIG. 4F, the substrate 40 is turned upside down so that arear surface RS of the substrate 40 is on top. Next, the substrate 40 ispartially removed until the bonding structure 47 is exposed. Therefore,the bonding structure 47 may be exposed on the rear surface RS of thesubstrate 40. Specifically, the bonding portion 47B may be exposed onthe rear surface RS of the substrate 40. In an embodiment, the substrate40 may be partially removed by using a back grinding method, a chemicalmechanical polishing (CMP) method, or a wet etching process, or acombination thereof. In the process of partially removing the substrate40, a portion of the bonding portion 47B and a portion of the insulatingspacer 46 may be removed as well. In addition, the width of theremaining bonding portion 47B may be adjusted according to the amount ofthe substrate 40 that is removed.

Referring to FIG. 4G, a first chip CHIP_1 and a second chip CHIP_2 arebonded to each other.

The first chip CHIP_1 and the second chip CHIP_2 may be prepared byrepeating the processes of FIGS. 4A to 4F. In addition, in order toprepare the first chip CHIP_1 and the second chip CHIP_2, a process ofcutting the wafer into a chip unit may be further performed. Forexample, the substrate 40 on which the main structure MS, the bondingstructure 47, and the like are formed, is cut and separated into aplurality of chips.

The first chip CHIP_1 and the second chip CHIP_2 may include the samemain structure MS or may include different main structures MS. Two ormore chips may be bonded to each other. In addition to bonding a chipand a chip to each other chips, a wafer and a wafer or a wafer and achip may be bonded to each other.

The second interlayer insulating film 43 of the first chip CHIP_1 andthe substrate 40 of the second chip CHIP_2 may be bonded to each otherthrough the bonding process. For example, the rear surface RS of thesubstrate 40 of the second chip CHIP_2 may be in contact with and bondedto the second interlayer insulating film 43 of the first chip CHIP_1.

The bonding structure 47 of the first chip CHIP_1 and the bondingstructure 47 of the second chip CHIP_2 may be bonded to each other. Forexample, the through portion 47A of the first chip CHIP_1 and thebonding portion 47B of the second chip CHIP_2 may be bonded to eachother. Therefore, the bonding structure 47 of the first chip CHIP_1 andthe bonding structure 47 of the second chip CHIP_2 may be electricallyconnected to each other, and the first chip CHIP_1 and the second chipCHIP_2 may be electrically connected to each other. In addition, sincethe bonding portion 47B of the second chip CHIP_2 is wider than thethrough portion 47A of the first chip CHIP_1, the margin of error foralignment between the first chip CHIP_1 and the second chip CHIP_2 maybe increased.

Next, although not shown in the present figure, an additional packagingprocess, such as wire bonding, molding, and marking, may be performed.

In the above-described method, FIGS. 4A to 4E may correspond to the FABprocess S310 of FIG. 3, and FIGS. 4F and 4G may correspond to thepackage process S320 of FIG. 3. According to the above-described method,the bonding structure may be formed in the FAB process. Therefore, abump, a non-conductive film (NCF), or the like is not required to beformed. In addition, the physical and electrical connection between thefirst chip CHIP_1 and the second chip CHIP_2 may be simultaneouslyperformed. Therefore, the package process may be simplified and the costmay be reduced.

FIGS. 5A to 5C are diagrams for describing a method of manufacturing asemiconductor device, according to an embodiment of the presentdisclosure, and relates to a method of forming a bonding structure.Hereinafter, descriptions that are repetitive will be omitted.

Referring to FIG. 5A, a first opening OP1, passing through a secondinterlayer insulating film 63, a metal wire 62, and a first interlayerinsulating film 61, and a second opening OP2 that are positioned in asubstrate 60, are formed.

Next, an insulating material 64 is formed in the first opening OP1 andthe second opening OP2. For example, the insulating material isdeposited along the inner surfaces of the first opening OP1 and thesecond opening OP2. The insulating material 64 may also be formed on thesecond interlayer insulating film 63. The insulating material 64 mayinclude an oxide.

Referring to FIG. 5B, the insulating material 64 is partially etched toexpose the metal wires 62 in the first opening OP1. In order topartially etch the insulating material 64, a sacrificial film 65 and amask pattern 66 may be used. First, the sacrificial film 65 and the maskpattern 66 are formed.

The sacrificial film 65 may be formed to fill the second opening OP2 andat least partially fill the first opening OP1. The sacrificial film 65may include a liquidity material such as spin on carbon (SOC). Thesacrificial film 65 may also be formed on the second interlayerinsulating film 63.

Next, the insulating material 64 is etched using the mask pattern 66 asan etching barrier. Therefore, the metal wire 62 is exposed, and theinsulating spacer 64A is formed. Next, the mask pattern 66, thesacrificial film 65, and the insulating material 64 may be removed and acleaning process may be performed.

Referring to FIG. 5C, a bonding structure 67 is formed. The bondingstructure 67 may include a through portion 67A that is in contact withthe metal wire 62 and a bonding portion 67B that is formed in thesubstrate 60. The insulating spacer 64A may be interposed between thebonding portion 67B and the substrate 60 to insulate the bonding portion67B and the substrate 60 from each other. In addition, the insulatingspacer 64A may extend up to a portion of the sidewall of the throughportion 67A and may be formed to surround a portion of the sidewall ofthe through portion 67A. The insulating spacer 64A may be interposedbetween the through portion 67A and the first interlayer insulating film61. However, the insulating spacer 64A is not interposed between thethrough portion 67A and the metal wire 62. Next, although not shown inthe present figure, the process described above, with reference to FIGS.4F and 4G, may be further performed.

According to the above-described manufacturing method, the insulatingspacer 64A may be formed using a deposition process.

FIG. 6 is a block diagram illustrating a configuration of a memorysystem, according to an embodiment of the present disclosure.

Referring to FIG. 6, the memory system 1000 includes a memory device1200 and a controller 1100.

The memory device 1200 is used to store various data types, such as atext, a graphic, and a software code. The memory device 1200 may be anon-volatile memory. In addition, the memory device 1200 may have thestructure that is described above with reference to FIGS. 1A to 5C. Thememory device 1200 may be manufactured based on the manufacturing methodthat is described with reference to FIGS. 1A to 5C. As an embodiment,the memory device 1200 may include a first chip that includes a firstsubstrate, a first cell array, a first metal wire, and a first bondingstructure. The first bonding structure may include a first throughportion that passes through the first metal wire and a first bondingportion, formed in the first substrate. A second chip may include asecond substrate, a second cell array, a second metal wire, and a secondbonding structure. The second bonding structure may include a secondthrough portion that passes through the second metal wire and a secondbonding portion, formed in the second substrate. The second chip may bebonded to the first chip. Specifically, the first bonding portion of thefirst chip and the second through portion of the second chip may bebonded to each other. Since the structure of the memory device 1200 andthe method of manufacturing the memory device 1200 are the same as thedescription in reference FIGS. 1A to 5C, a detailed description thereofwill be omitted.

The controller 1100 is connected to a host, and the memory device 1200and is configured to access the memory device 1200 in response to arequest from the host. For example, the controller 1100 is configured tocontrol read, write, erase, and background operations, and the like ofthe memory device 1200.

The controller 1100 includes a random access memory (RAM) 1110, acentral processing unit (CPU) 1120, a host interface 1130, an errorcorrection code circuit 1140, a memory interface 1150, and the like.

Here, the RAM 1110 may be used as an operation memory of the CPU 1120, acache memory between the memory device 1200 and the host, a buffermemory between the memory device 1200 and the host, and the like. Forreference, the RAM 1110 may be replaced with a static random accessmemory (SRAM), a read only memory (ROM), or the like.

The CPU 1120 is configured to control overall operation of thecontroller 1100. For example, the CPU 1120 is configured to operatefirmware such as a flash translation layer (FTL) stored in the RAM 1110.

The host interface 1130 is configured to perform an interface with thehost. For example, the controller 1100 communicates with the hostthrough at least one of various interface protocols such as a universalserial bus (USB) protocol, a multimedia card (MMC) protocol, aperipheral component interconnection (PCI) protocol, a PCI-express(PCI-E) protocol, an advanced technology attachment (ATA) protocol, aserial-ATA protocol, a parallel-ATA protocol, a small computer smallinterface (SCSI) protocol, an enhanced small disk interface (ESDI)protocol, an integrated drive electronics (IDE) protocol, and a privateprotocol.

The ECC circuit 1140 is configured to detect and correct an errorincluded in data read from the memory device 1200 using an errorcorrection code (ECC).

The memory interface 1150 is configured to perform interfacing with thememory device 1200. For example, the memory interface 1150 includes aNAND interface or a NOR interface.

For reference, the controller 1100 may further include a buffer memory(not shown) for temporarily storing data. Here, the buffer memory may beused to temporarily store data transferred to the outside through thehost interface 1130, or to temporarily store data transferred from thememory device 1200 through the memory interface 1150. In addition, thecontroller 1100 may further include a ROM that stores code data forinterfacing with the host.

As described above, since the memory system 1000 according to anembodiment of the present disclosure includes the memory device 1200having an improved degree of integration and an improved characteristic,a degree of integration and a characteristic of the memory system 1000may also be improved.

FIG. 7 is a block diagram, illustrating a configuration of a memorysystem, according to an embodiment of the present disclosure.Hereinafter, descriptions that are repetitive will be omitted.

Referring to FIG. 7, the memory system 1000′ includes a memory device1200′ and a controller 1100. In addition, the controller 1100 includes aRAM 1110, a CPU 1120, a host interface 1130, an ECC circuit 1140, amemory interface 1150, and the like.

The memory device 1200′ may be a non-volatile memory. The memory device1200′ may have the structure that is described above with reference toFIGS. 1A to 5C and may be manufactured according to the manufacturingmethod that is described with reference to FIGS. 1A to 5C. As anembodiment, the memory device 1200′ may include a first chip thatincludes a first substrate, a first cell array, a first metal wire, anda first bonding structure. The first bonding structure may include afirst through portion that passes through the first metal wire and afirst bonding portion, formed in the first substrate. A second chip mayinclude a second substrate, a second cell array, a second metal wire,and a second bonding structure. The second bonding structure may includea second through portion that passes through the second metal wire and asecond bonding portion, formed in the second substrate. The second chipmay be bonded to the first chip. Specifically, the first bonding portionof the first chip and the second through portion of the second chip maybe bonded to each other. Since the structure of the memory device 1200′and the method of manufacturing the memory device 1200′ are the same asthe description in reference FIGS. 1A to 5C, a detailed descriptionthereof will be omitted.

In addition, the memory device 1200′ may be a multi-chip packageconfigured of a plurality of memory chips. The plurality of memory chipsare divided into a plurality of groups, and the plurality of groups areconfigured to communicate with the controller 1100 through first to k-thchannels CH1 to CHk. In addition, the memory chips that belong to onegroup are configured to communicate with the controller 1100 through acommon channel. For reference, the memory system 1000′ may be modifiedsuch that one memory chip is connected to one channel.

As described above, since the memory system 1000′ according to anembodiment of the present disclosure includes the memory device 1200′having an improved degree of integration and an improved characteristic,a degree of integration and a characteristic of the memory system 1000′may also be improved. In particular, by configuring the memory device1200′ in a multi-chip package, data storage capacity of the memorysystem 1000′ may be increased, and the driving speed may be improved.

FIG. 8 is a block diagram, illustrating a configuration of a computingsystem, according to an embodiment of the present disclosure.Hereinafter, descriptions that are repetitive will be omitted.

Referring to FIG. 8, the computing system 2000 includes a memory device2100, a CPU 2200, a RAM 2300, a user interface 2400, a power supply2500, a system bus 2600, and the like.

The memory device 2100 stores data that is provided through the userinterface 2400, data that is processed by the CPU 2200, and the like. Inaddition, the memory device 2100 is electrically connected to the CPU2200, the RAM 2300, the user interface 2400, the power supply 2500, andthe like through the system bus 2600. For example, the memory device2100 may be connected to the system bus 2600 through a controller (notshown) or may be directly connected to the system bus 2600. When thememory device 2100 is directly connected to the system bus 2600, thefunction of the controller may be performed by the CPU 2200, the RAM2300, and the like.

Here, the memory device 2100 may be a non-volatile memory. The memorydevice 2100 may have the structure that is described above withreference to FIGS. 1A to 5C, and may be manufactured according to themanufacturing method that is described with reference to FIGS. 1A to 5C.As an embodiment, the memory device 2100 may include a first chip thatincludes a first substrate, a first cell array, a first metal wire, anda first bonding structure. The first bonding structure may include afirst through portion that passes through the first metal wire and afirst bonding portion, formed in the first substrate. A second chip mayinclude a second substrate, a second cell array, a second metal wire,and a second bonding structure. The second bonding structure may includea second through portion that passes through the second metal wire and asecond bonding portion, formed in the second substrate. The second chipmay be bonded to the first chip. Specifically, the first bonding portionof the first chip and the second through portion of the second chip maybe bonded to each other. Since the structure of the memory device 2100and the method of manufacturing the memory device 2100 are the same asthe description in reference FIGS. 1A to 5C, a detailed descriptionthereof will be omitted.

In addition, the memory device 2100 may be a multi-chip package thatincludes a plurality of memory chips as described with reference to FIG.7.

The computing system having such a configuration may be a computer, anultra-mobile PC (UMPC), a workstation, a net-book, a personal digitalassistants (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a smart phone, an e-book, a portable multimedia player(PMP), a portable game machine, a navigation device, a black box, adigital camera, a 3-dimensional television, a digital audio recorder, adigital audio player, a digital picture recorder, a digital pictureplayer, a digital video recorder, and a digital video player, a devicecapable of transmitting and receiving information in a wirelessenvironment, one of various electronic devices configuring a homenetwork, one of various electronic devices configuring a computernetwork, one of various electronic devices configuring a telematicsnetwork, an RFID device, or the like.

As described above, since the computing system 2000 according to anembodiment of the present disclosure includes the memory device 2100having an improved degree of integration and an improved characteristic,a characteristic of the computing system 2000 may also be improved.

FIG. 9 is a block diagram, illustrating a computing system, according toan embodiment of the present disclosure.

Referring to FIG. 9, the computing system 3000 includes a software layerthat includes an operating system 3200, an application 3100, a filesystem 3300, a translation layer 3400, and the like. In addition, thecomputing system 3000 includes a hardware layer such as a memory device3500.

The operating system 3200 may manage software, hardware resources, andthe like of the computing system 3000, and may control program executionof a central processing unit. The application 3100 may be variousapplication programs that are executed on the computing system 3000 andmay be a utility that is executed by the operating system 3200.

The file system 3300 refers to a logical structure for managing data, afile, and the like that exist in the computing system 3000. The filesystem 3300 may organize the file or data to be stored in the memorydevice 3500 based on a rule. The file system 3300 may be determinedbased on the operating system 3200 that is used in the computing system3000. For example, when the operating system 3200 is a Windows system ofMicrosoft company, the file system 3300 may be a file allocation table(FAT), an NT file system (NTFS), or the like. In addition, when theoperating system 3200 is a Unix/Linux system, the file system 3300 maybe an extended file system (EXT), a Unix file system (UFS), a journalingfile system (JFS), or the like.

Although the operating system 3200, the application 3100, and the filesystem 3300 are shown as separate blocks in the present figure, theapplication 3100 and the file system 3300 may be included in theoperating system 3200.

The translation layer 3400 converts an address in a form suitable forthe memory device 3500 in response to a request from the file system3300. For example, the translation layer 3400 converts a logical addressgenerated by the file system 3300 into a physical address of the memorydevice 3500. Here, mapping information of the logical address and thephysical address may be stored in an address translation table. Forexample, the translation layer 3400 may be a flash translation layer(FTL), a universal flash storage link layer (ULL), or the like.

The memory device 3500 may be a non-volatile memory. In addition, thememory device 3500 may have the structure described above with referenceto FIGS. 1A to 5C, and may be manufactured according to themanufacturing method described with reference to FIGS. 1A to 5C. As anembodiment, the memory device 3500 may include a first chip thatincludes a first substrate, a first cell array, a first metal wire, anda first bonding structure. The first bonding structure may include afirst through portion that passes through the first metal wire and afirst bonding portion, formed in the first substrate. A second chip mayinclude a second substrate, a second cell array, a second metal wire,and a second bonding structure. The second bonding structure may includea second through portion that passes through the second metal wire and asecond bonding portion, formed in the second substrate. The second chipmay be bonded to the first chip. Specifically, the first bonding portionof the first chip and the second through portion of the second chip maybe bonded to each other. Since the structure of the memory device 3500and the method of manufacturing the memory device 3500 are the same asthe description in reference FIGS. 1A to 5C, a detailed descriptionthereof will be omitted.

The computing system 3000, having such a configuration, may be dividedinto an operating system layer that is performed in a higher levelregion and a controller layer that is performed in a lower level region.Here, the application 3100, the operating system 3200, and the filesystem 3300 may be included in the operating system layer and may bedriven by an operation memory of the computing system 3000. In addition,the translation layer 3400 may be included in the operating system layeror in the controller layer.

As described above, since the computing system 3000 includes the memorydevice 3500, having an improved degree of integration and an improvedcharacteristic, a characteristic of the computing system 3000 may alsobe improved.

Although the technical spirit of the present disclosure has beenspecifically described according to the embodiments, it should be notedthat the above-described embodiments are for the purpose of descriptionand not of limitation. In addition, those skilled in the art willunderstand that various embodiments are possible within the scope of thetechnical spirit of the present disclosure.

What is claimed is:
 1. A semiconductor device comprising: a first chipincluding a first semiconductor substrate, a first cell array, a firstmetal wire, and a first bonding structure, wherein the first bondingstructure includes a first through portion that passes through the firstmetal wire and a first bonding portion that is formed in the firstsemiconductor substrate; and a second chip, bonded to the first chip,including a second semiconductor substrate, a second cell array, asecond metal wire, and a second bonding structure, wherein the secondbonding structure includes a second through portion that passes throughthe second metal wire and a second bonding portion formed in the secondsemiconductor substrate, wherein the first bonding portion of the firstchip is configured to be bonded to the second through portion of thesecond chip.
 2. The semiconductor device of claim 1, wherein the firstbonding portion has a width that is wider than a width of the firstthrough portion, and wherein the second bonding portion has a width thatis wider than a width of the second through portion.
 3. Thesemiconductor device of claim 1, wherein the first chip further includesan insulating spacer interposed between the first bonding portion andthe first semiconductor substrate.
 4. The semiconductor device of claim1, wherein the first bonding portion has a width that is wider than awidth of the second through portion.
 5. The semiconductor device ofclaim 1, wherein the first cell array is formed on a front surface ofthe first semiconductor substrate, and the first bonding portion isexposed to an exterior of the first chip through a rear surface of thefirst semiconductor substrate.
 6. The semiconductor device of claim 1,wherein the first semiconductor substrate is positioned between thefirst cell array and the second cell array.
 7. The semiconductor deviceof claim 1, wherein the second metal wire is positioned between thefirst semiconductor substrate and the second semiconductor substrate. 8.The semiconductor device of claim 1, wherein the second chip furtherincludes an interlayer insulating film covering the second metal wire,wherein the first semiconductor substrate includes a front surface onwhich the first cell array is formed, wherein the first semiconductorsubstrate includes a rear surface being on an opposite side of the frontsurface, and wherein the interlayer insulating film and the rear surfaceof the first semiconductor substrate are bonded to each other.
 9. Thesemiconductor device of claim 1, wherein the first chip further includesa first peripheral circuit.
 10. The semiconductor device of claim 1,wherein the first cell array includes a memory string.
 11. Thesemiconductor device of claim 1, wherein the first bonding portion ofthe first chip directly contacts the second through portion of thesecond chip.
 12. The semiconductor device of claim 1, wherein the firstthrough portion is coupled to the first bonding portion as a singlefilm.
 13. A semiconductor device comprising: a first chip including afirst substrate, a first metal wire, a first bonding structure, and afirst interlayer insulating film, wherein the first metal wire and thefirst interlayer insulating film are formed on a front surface of thefirst substrate, and the first bonding structure includes a firstthrough portion that passes through the first metal wire and a firstbonding portion that is formed in the first substrate and exposed to anexterior of the first chip through a rear surface of the firstsubstrate; and a second chip, bonded to the first chip, including asecond substrate, a second metal wire, a second bonding structure, and asecond interlayer insulating film, wherein the second metal wire and thesecond interlayer insulating film are formed on a front surface of thesecond substrate, and the second bonding structure includes a secondthrough portion that passes through the second metal wire and a secondbonding portion that is formed in the second substrate and exposed to anexterior of the second chip through a rear surface of the secondsubstrate, wherein the rear surface of the first substrate and thesecond interlayer insulating film are bonded to each other at a bondinginterface between the first chip and the second chip, and the firstbonding portion is directly bonded to the second through portion. 14.The semiconductor device of claim 13, wherein the first bonding portionhas a width that is wider than a width of the first through portion, andwherein the second bonding portion has a width that is wider than awidth of the second through portion.
 15. The semiconductor device ofclaim 13, wherein the first bonding portion has a rounded sidewall. 16.The semiconductor device of claim 13, wherein the first bondingstructure and the second bonding structure include a conductivematerial.
 17. The semiconductor device of claim 13, wherein the firstsubstrate is a semiconductor substrate.
 18. The semiconductor device ofclaim 13, wherein the first through portion is coupled to the firstbonding portion as a single film.
 19. A semiconductor device comprising:a first chip including a first substrate, a first cell array, a firstinterlayer insulating film, and a first bonding structure, wherein thefirst bonding structure includes a first bonding portion formed in thefirst substrate and a first through portion passing through the firstinterlayer insulating film and coupled to the first bonding portion as asingle layer; and a second chip, bonded to the first chip, including asecond substrate, a second cell array, a second interlayer insulatingfilm, and a second bonding structure, wherein the second bondingstructure includes a second bonding portion formed in the secondsubstrate and a second through portion passing through the secondinterlayer insulating film and coupled to the second bonding portion asa single layer, wherein the first bonding portion of the first chip isbonded to the second through portion of the second chip.
 20. Thesemiconductor device of claim 19, wherein the first bonding portiondirectly contacts the second through portion at a bonding interfacebetween the first chip and the second chip.